Name: Next generation co packaged optics systems
Uploaded: 2025-11-23T02:47:57.000Z
Duration: 16 min 10 s
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So we're here to talk to you about the next generation of CPO systems design.

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So it's going to be more focused on the system, less on the optics, just to kind of set the stage.

But before we begin, just a, you know, standard boilerplate on forward looking statements.

So what we're showing here can refer to future plans.

We'll briefly talk about the benefits of CO package optics that we see.

I think there's been a lot of discussion on that lately over the past several months.

We'll give you a description of the system that we're showcasing today on our show floor, both in the JBL booth and the Marvell booth.

We'll talk a little bit about the form factor, give you some highlights on the block diagram, the components, the cooling solutions, the power and of course some software discussion.

We'll also give a brief discussion on the lessons that we learned putting together the system.

This was a fairly challenging system design.

I mean it wasn't easy to do and I think there's some benefit for all of us to learn from that experience and then we'll follow with the call to action.

So it goes without saying, most pluggable solutions today you're going to see some integrated circuit on a substrate driving from a SERDES down through the BGA ball out of a PCB and up to a transceiver cage into a dsp.

So there are quite a few components in this channel.

Now to be clear, we still think there is a market for pluggable transceivers for certain applications.

But in other applications there are distinct advantages of going to cpo.

Right on the bottom you'll see an equivalent CPO channel where you see an ic, a substrate or maybe an interposer in some cases with co packaging of the optical engine.

So the SERDES is driving the optics directly.

The SERDES would have the DSP with the equalizer and you can go do the electrical and optical conversion directly on package and bring fiber out to the front panel.

So this results in lower power, lower latency, fewer components.

So I think many of our peers have talked about the same advantages, but

these are real advantages from a perspective of cpo.

So the switch that we are talking about today is a base product specification by Marvell and Jabils collaboration.

There are block diagrams, mechanical specifications, thermal specs and power specs.

We will also have software support, especially on the optics management that we're currently working on, but

And as we go into the switch, you can see here we followed the open rack V3 standard.

We wanted to keep it to a standard specification, mainly ORV3.

This is a one ou design utilizing the Teralink switch family and the previously announced Marvell 6.4T optical engine.

The design is capable of up to 100 terabits per second front panel bandwidth and we are packing 16 ELSS and 64 Senko SNMT connectors on the front plate to route the fiber within the tray.

We're using a midboard connector approach.

This is mainly to support better well, mainly for manufacturability and modular design.

So we can design the mainboard pcb, the ELS PCB independently and connect things independently so we if we have a yield fallout, we don't have to throw away a system liquid and air cooled.

In our next generation we're looking at fully liquid cooled.

But liquid cooling I think as everyone has been saying is going to be extremely important even for cpo.

Not just for power considerations but also for density.

We were trying to make a very, very high bandwidth system in a very small form factor.

Just to wrap it up, we are also using a KAMI from Portwell for x86.

This is for the control plane in this case for the switch as well as an optional bmc.

So if you're intending to deploy and you use out of band management, there will be a BMC option.

So here's just a pictorial of that system we described just to give you a high level view of what it looks like.

And we do have some pictures that we'll showcase later.

And I encourage everyone, if you haven't been to the Marvell or Jabil booths, please stop by and take a look.

So as we said, the SNS will be on the front, the ELSS are on the front and this system has a provision for DC busbar.

But right now we're showcasing for with AC power mainly just for desktop evaluation, but

So a little bit about how we went into this from the system design.

As we look at CO packaged optics, we truly believe it's not a matter of if, it's a matter of when and when it hits.

Like everything else driven by AI, it's going to have a very fast adoption rate.

So from a scale manufacturing perspective we have to be Ready to do this.

And this creates that pilot vehicle to validate all the processes, to validate what it takes to actually deliver tens of thousands or hundreds of thousands of units per year versus a normal ramp that you would have seen before.

AI so a couple of the key things here is that utilizing the open compute kind of mentality around dcmhs, we've built this with a modular concept in mind.

And we actually started this around 2016 when we did some of our first switches.

And when I get to the block diagram, I'll talk a little bit more about that.

But needless to say, we think about the management, the data and then the front IO and the chassis.

Some of the things here that are pretty critical is that we did comply to the ORV3 standard with the blind mate for the liquid cooling.

As we look at liquid cooling, it's really going to depend on the environments that you choose to deploy in.

There's certain environments where it's full liquid, they don't want any airflow.

But what we're also seeing is a lot of hybrid environments.

And when you think about keeping the lasers cool so you get good efficiency out of them, they actually have the best seat in the house.

They're sitting on the cold aisle, they get the air the first, and

However, if your data center is not equipped to handle air cooled equipment, we also have cold plate capabilities to place on those as well.

In this first iteration, we left them air cooled as it's a desktop model.

The second thing is, as we thought about this, we thought about it from two perspectives around manufacturability, but

also what are we going to want to do in the field?

Is there going to be any field maintenance or any field upgrade that happens as we're thinking about that?

That's why we went to this distributed midplane connector strategy.

And it allows us flexibility in the factory to make sure that we have high yields, high manufacturing throughput.

And in the field, what it means is if we damage a lens on the front panel, I don't have to take the whole thing apart.

I can replace just the link that goes to the front panel.

As we talk about what did we actually do with the electronics, I would say a couple things about this.

First of all, it's kind of there's nothing to see here.

It's the same as you would expect for electronics on the board.

So from a management philosophy, from a how do we think about it?

All that happened was that Data plane came out of the PCBA and now it floats above it.

So when we think about how do we design this, we had to go from playing 2D chess to playing 3D chess because I have to do air traffic control around where's my liquid going?

And I also had to be concerned about my airflows because I'm in a hybrid environment here.

As I stated in 2016, we started this and we built a universal management complex.

The idea there is that I can take all the IO types that I need, whether it's i2c, whether I go to i3c, whether it's spy network, whatever is required there, and

I put them together and I can deploy to whatever the processor needs and whatever the surrounding sensors need to.

And we've used this across campus networks, across passive optical networks, and across data center networks.

So this same technology, once again with the DCMHS concept, is a building block that's usable across multiple product sets.

The other thing we did here is we did have to separate from a PCB perspective, the elsfp.

When you see the picture of it, you'll see we have a main board and then we have the front board.

There were two reasons we had to do this.

The first one is that to fit into one ou, there's a lot of stuff that has to happen.

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Next generation co packaged optics systems

perspective

absolutely

process

critical